Indium flux

• PoP solder paste is primarily used when warping of the component occurs and the solder paste bridges the gap created by warping of printed circuit boards or substrates.
• PoP flux is usually preferred over PoP paste because it is easier to set up and control the process
• The package is dipped in either a specially formulated PoP flux or PoP paste and then placed on the chip.

Indium Corporation's most popular PoP fluxes include:

• PoP Flux 89HF-LV
• PoP Flux 89HFLV-B
• PoP Flux 89-LV
• PoP Flux 89LV-B
• PoP Flux 89LV-P

• TACFlux® 020B-RC is the latest addition to our popular TACFlux® product line.
• TACFlux® 020B-RD is a no-clean flux formulated for both SnPb and Pb-free brazing.
• Among the many applications are: Rework and repair of various electronic assemblies and components, SMT components, BGA ball-attach, preforms and virtually any application where a flux is required.
• It is halogen-free and passes SIR in a non-molten state, which is ideal for rework applications where the flux may not be properly heated.

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