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Parmi Automatic Optical Inspection
The best of 3D AOI systems. Whether we're helping you increase your board yield and throughput, solve a unique challenge, or increase your ROI, Parmi systems give you a competitive edge. Parmi has developed its new generation Xceed 3D AOI (Automated Optical Inspection) to improve your processes.
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3D Automatic Optical Inspection
- Highly accurate and stable laser measurement
- Fastest inspection in the industry
- Inspections up to 65mm height
- Real 3D images
- Inspection is Irrelevant to Colors, Material and Surface
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Subpage inspector optimized for THT process
- 3D AOI for bottom side inspection
- Space saving due to elimination of PCB flip unit
- Primary inspection functions: Wave or selective soldering, including THD pin position and height, and solder joint inspection.
- Complete testing of printed circuit boards with mixed technology
- 100% inspection of PCB warps and foreign material without affecting cycle time
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Scan-based precision inspection system for conformal coatings
- First scan-based precision inspection system for conformal coatings
- Coverage, contamination and bubble inspection
- Measurement of plate and component thickness with a laser height measurement sensor
- Testing of coating and coating thickness on tall components with Z-axis
- Precise coating thickness measurement
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Ultra-precise laser scan 3D AOI for semiconductor packaging
- Extremely fast laser scan 2D & 3D AOI
- High-focus 2-channel laser for 3D data generation
- 3D laser can inspect high gloss surfaces
- High bandwidth with a wide range of colors, surface roughnesses and materials
- Virtually no breakout and missed call rates
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